WL BGA Reballing Stencil Kit for iPhone 6G 6S 7G 8G X XS XSMAX A7 A8 A9 A10 A11 A12 A13 CPU Upper Lower Soldering rework tool |



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Цена:1 100,15RUB
*Стоимость могла изменится

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WL BGA Reballing Stencil Kit for iPhone 6G 6S 7G 8G X XS XSMAX A7 A8 A9 A10 A11 A12 A13 CPU Upper Lower Soldering rework tool |

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*Текущая стоимость 1 100,15 уже могла изменится. Что бы узнать актуальную цену и проверить наличие товара, нажмите "Добавить в корзину"

Месяц Минимальная цена Макс. стоимость Цена
Sep-16-2025 1309.12 руб. 1374.36 руб. 1341.5 руб.
Aug-16-2025 1298.31 руб. 1363.46 руб. 1330.5 руб.
Jul-16-2025 1089.85 руб. 1143.23 руб. 1116 руб.
Jun-16-2025 1276.6 руб. 1340.18 руб. 1308 руб.
May-16-2025 1111.49 руб. 1167.85 руб. 1139 руб.
Apr-16-2025 1254.9 руб. 1317.66 руб. 1285.5 руб.
Mar-16-2025 1243.34 руб. 1305.56 руб. 1274 руб.
Feb-16-2025 1232.66 руб. 1294.94 руб. 1263 руб.
Jan-16-2025 1221.30 руб. 1282.86 руб. 1251.5 руб.

Описание товара

WL BGA Reballing Stencil Kit for iPhone 6G 6S 7G 8G X XS XSMAX A7 A8 A9 A10 A11 A12 A13 CPU Upper Lower Soldering rework tool |WL BGA Reballing Stencil Kit for iPhone 6G 6S 7G 8G X XS XSMAX A7 A8 A9 A10 A11 A12 A13 CPU Upper Lower Soldering rework tool |WL BGA Reballing Stencil Kit for iPhone 6G 6S 7G 8G X XS XSMAX A7 A8 A9 A10 A11 A12 A13 CPU Upper Lower Soldering rework tool |WL BGA Reballing Stencil Kit for iPhone 6G 6S 7G 8G X XS XSMAX A7 A8 A9 A10 A11 A12 A13 CPU Upper Lower Soldering rework tool |WL BGA Reballing Stencil Kit for iPhone 6G 6S 7G 8G X XS XSMAX A7 A8 A9 A10 A11 A12 A13 CPU Upper Lower Soldering rework tool |WL BGA Reballing Stencil Kit for iPhone 6G 6S 7G 8G X XS XSMAX A7 A8 A9 A10 A11 A12 A13 CPU Upper Lower Soldering rework tool |


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High Quality WL BGA Reballing Stencil Kit for iPhone 6G 6S 7G 8G X XS XSMAX A7 A8 A9 A10 A11 A12 CPU Upper Lower Soldering Precise positioning mold
Product description:
Optional 1Magnetic baseThis is a universal mold
Optional 2A11 whole cpu mold
Optional 3A12 whole cpu mold
Optional 4A8 whole cpu mold
Optional 5A 9  whole cpu mold
Optional 6A10  whole cpu mold
Optional 7A8 Upper
Optional 8A8 lower
Optional 9A9 Upper
Optional 10A9 lower
Optional 11A10 Upper
Optional 12A10 lower
A8-10 There is a separate upper positioning mold and plant tin mesh, A11 A12 is the CPU as a whole into the lower layer cpu plant tin network
With Fixed Plate ( Black Positioning Mold ), Easy to use and more accurate CPU IC welding position.A
[ Option Aluminum Mould Base ]: it is universal, can fit with any Black Positioning Mold,
Option Positioning Mold (Black): Not univeral, can't working with different BGA Reballing Stencil, need the right model BGA Reballing Stencil, the Black Positioning Mold just match with the right BGA Reballing Stencil.



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